Research Library

The top resource for free research, white papers, reports, case studies, magazines, and eBooks.

Share Your Content with Us
on TradePub.com for readers like you. LEARN MORE
System-Level Connectivity Management & Verification of 3D IC Heterogeneous Assemblies
Request Your Free White Paper Now:

"System-Level Connectivity Management & Verification of 3D IC Heterogeneous Assemblies"

Integrating multiple dies and substrates into a single package continues to be a major focus of the semiconductors industry. Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge.

This is especially true when each substrate is built using a different methodology, team, and/or format.

Designers need an EDA platform such as Xpedition Substrate Integrator (xSI) that can aggregate the different formats for a multi-substrate system and generate a system-level netlist that drives assembly verification. Assembly verification using Xpedition Substrate Integrator and Calibre 3DSTACK is a “designer-centric” approach, as it is agnostic to the different die technology nodes and substrate manufacturers.


Offered Free by: engineering.com and Siemens Digital Industries Software
See All Resources from: engineering.com and Siemens Digital Industries Software

Recommended for Professionals Like You: